Effect of ohmic heating on the structure and properties of flexible multilayer packaging

Abstract

Food-packaging-processing interactions define packaging materials’ performance properties and product quality. This study evaluated the effect of ohmic heating (OH) processing and different food simulants on the properties of four multilayer flexible packaging materials (PETmet/PE, PETmet/PP, PET/Al/PE, and PET/Al/PA/PP). OH treatment was applied to the sealed packages containing the food simulants using a voltage gradient of 3.7 V/cm at a frequency of 20 kHz, resulting in a thermal process of at 80 ◦C for 1 min. The structure and performance of the different packages were then evaluated. The materials did not show changes in chemical groups nor thermal properties. However, the simulant-packaging-processing interaction resulted in changes in crystallinity, morphology, mechanical and barrier properties (water and oxygen), especially for metallized films in contact with acidic food simulants. The results indicate that although OH resulted in changes in packaging materials, these materials can be used under the conditions applied in this study.